H10W 72/01261
Chemical or physical modification
Official title: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01251)}
H10W72/01261 (Chemical or physical modification) appears on 221 US grants and 270 published applications in this corpus.
Search patents in H10W- Granted patents
- 221
- Published applications
- 270
- Assignees
- 126
- Inventors
- 522
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 3 | 4 |
| 2003 | 6 | 10 |
| 2004 | 1 | 3 |
| 2005 | 6 | 4 |
| 2006 | 6 | 10 |
| 2007 | 3 | 12 |
| 2008 | 6 | 13 |
| 2009 | 6 | 18 |
| 2010 | 11 | 14 |
| 2011 | 15 | 16 |
| 2012 | 8 | 12 |
| 2013 | 13 | 14 |
| 2014 | 8 | 9 |
| 2015 | 13 | 11 |
| 2016 | 8 | 11 |
| 2017 | 11 | 11 |
| 2018 | 4 | 11 |
| 2019 | 12 | 8 |
| 2020 | 17 | 25 |
| 2021 | 9 | 12 |
| 2022 | 13 | 15 |
| 2023 | 11 | 8 |
| 2024 | 5 | 6 |
| 2025 | 6 | 6 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps25 Aug 2026US 12,721,203 B2
- Electronic chips including J-shaped substrate sidewalls23 Jun 2026US 12,667,030 B2STMicroelectronics (Tours) SAS
- Method for manufacturing semiconductor device including forming opening in resist of the semiconductor device21 Apr 2026US 12,610,840 B2Panasonic Intellectual Property Management Co., Ltd.
- Semiconductor structure and method for forming the same and semiconductor device7 Apr 2026US 12,599,023 B2Winbond Electronics Corp.
- Package structure20 Jan 2026US 12,532,725 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Manufacture of electronic chips24 Sep 2026US 2026/0293781 A1STMicroelectronics (Tours) SAS
- Packaging conduction structure, package-on-package structure, and method of forming packaging conduction structure16 Jul 2026US 2026/0206644 A1Wistron Neweb Corp.
- Bonding structures formed using selective surface treatment of copper bumps and methods of forming the same30 Apr 2026US 2026/0123452 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure16 Apr 2026US 2026/0107755 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device interconnect structure and method therefor12 Mar 2026US 2026/0076246 A1NXP USA, Inc.
Most cited
By later US patents
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001
- Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same175US 5,470,787 AMotorola, Inc. · 1995
- Solder bump fabrication method104US 5,162,257 AMcnc · 1992
- Trilayer/bilayer solder bumps and fabrication methods therefor76US 6,492,197 B1Unitive Electronics, Inc. · 2002
- Lead-free interconnection for electronic devices70US 5,854,514 AInternational Buisness Machines Corporation · 1998