Packaging conduction structure, package-on-package structure, and method of forming packaging conduction structure
AssigneeWistron Neweb Corp.
InventorsSHEN-YU YANG, CHAO-CHIEH CHAN
Life of this patent
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Abstract
A packaging conduction structure includes a first packaging unit, a second packaging unit, and a conduction structure. The first packaging unit includes a first contact; the second packaging unit includes a second contact; and the conduction structure includes a first metal portion and a second metal portion, the first metal portion and the second metal portion are different metals, the second metal portion surrounds an entirety of the first metal portion, and the second metal portion is connected between the first contact and the second contact, wherein the first metal portion has a flat surface.
Claims18
A packaging conduction structure, comprising:
- a first packaging unit comprising a first contact;
- a second packaging unit comprising a second contact;
- and
- a conduction structure comprising a first metal portion and a second metal portion, the first metal portion and the second metal portion being different metals, the second metal portion surrounding an entirety of the first metal portion, and the second metal portion being connected between the first contact and the second contact;
- wherein the first metal portion has a flat surface.
A package-on-package (POP) structure, comprising:
- a first packaging unit comprising a first substrate and a first contact disposed on the first substrate;
- a second packaging unit comprising a second contact;
- and
- a plurality of conduction structures, each comprising a first metal portion and a second metal portion, the first metal portion and the second metal portion being different metals, the second metal portion surrounding an entirety of the first metal portion, and the first metal portion having a flat surface;
- wherein the first contact and the second contact are connected through one of the plurality of the conduction structures.
A method of forming a packaging conduction structure, comprising:
- providing a substrate, the substrate comprising a contact;
- connecting a composite metal ball to the contact, the composite metal ball including a first metal portion and a second metal portion, the first metal portion and the second metal portion being different metals, the second metal portion surrounding an entirety of the first metal portion;
- covering the substrate and the composite metal ball with an encapsulation layer;
- grinding or cutting the encapsulation layer and the composite metal ball in a direction parallel to the substrate, such that the first metal portion of the composite metal ball has a flat surface, and an exposed portion of the composite metal ball is exposed from the encapsulation layer;
- connecting a metal ball to the exposed portion of the composite metal ball;
- and
- applying heat such that the second metal portion of the composite metal ball and the metal ball fuse together.
Dependencies are inferred from the claim text.