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US 12,667,030 B2Granted
Electronic chips including J-shaped substrate sidewalls
AssigneeSTMicroelectronics (Tours) SAS
InventorsOlivier Ory, Michael De Cruz
Life of this patent
Estimating the term…
Abstract
An electronic chip including a semiconductor substrate carrying at least one metal contact extending, within the thickness of the substrate, along at least one flank of the chip.
Claims19
A device, comprising:
- a substrate including a first surface, a second surface opposite to the first surface, and a sidewall transverse to the first surface and the second surface;
- an interconnect layer on the first surface of the substrate, the interconnect layer including a conductive pad;
- an insulating layer is on and covers a first portion of the sidewall of the substrate;
- a conductive layer is coupled to the conductive pad at the first surface of the substrate, the conductive layer is on the insulating layer and covers the insulating layer, and the conductive layer is separated from the sidewall of substrate by the insulating layer;
- a first resin layer extends from the second surface of the substrate to the insulating layer and is on and covers a second portion of the sidewall of the substrate;
- and
- a second resin layer is on the second surface of the substrate, and
- wherein the first resin layer is on the second resin layer.
5 more elements
A device, comprising:
- a substrate including a first surface, a second surface opposite to the first surface, and a sidewall transverse to the first surface and the second surface;
- an interconnect layer on the first surface of the substrate, the interconnect layer including a conductive pad;
- an insulating layer is on and covers a first portion of the sidewall of the substrate and is on and covers a curved portion of the sidewall;
- a conductive layer is coupled to the conductive pad at the first surface of the substrate, the conductive layer is on the insulating layer and covers the insulating layer, and the conductive layer is separated from the sidewall of substrate by the insulating layer;
- a first resin layer extends from the second surface of the substrate to the insulating layer and is on and covers a second portion of the sidewall of the substrate;
- and
- a second resin layer is on the second surface of the substrate, and
- wherein the curved portion of the sidewall extends from the first portion of the sidewall to the second portion of the sidewall, and wherein the first resin layer is on the second resin layer.
5 more elements
A device, comprising:
- a substrate including a first surface, a second surface opposite to the first surface, a J-shaped sidewall that extends from the first surface, and a sidewall that extends from the second surface to the J-shaped sidewall;
- an interconnect layer on the first surface of the substrate, the interconnect layer including a conductive pad;
- an insulating layer is on and covers the J-shaped sidewall of the substrate;
- a conductive layer is coupled to the conductive pad at the first surface of the substrate, the conductive layer is on the insulating layer and covers the insulating layer, and the conductive layer is separated from the J-shaped sidewall of substrate by the insulating layer;
- a first resin layer extends from the second surface of the substrate to the conductive layer and is on and covers the sidewall of the substrate;
- and
- a second resin layer is on the second surface of the substrate, and
- wherein the first resin layer is on the second resin layer.
5 more elements
Dependencies are inferred from the claim text.