Lead-free interconnection for electronic devices

An electronic assembly formed by two electronic devices bonded together to establish electrical communication thereinbetween comprise a layer of a solid film positioned between said electrically conductive surfaces on said two devices, said film comprises a thermoplastic polymer binder and at least about 30% by weight of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer binder. said film deforms elastically to at least 15% deformation.

An electronic assembly formed by two electronic devices bonded together to establish electrical communication thereinbetween comprises a layer of a solid film positioned between said electrically conductive surfaces on said two devices, said film comprises a, thermoplastic polymer binder and at least about 30% by weight of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer binder such that the film converts from a resistivity of larger than 1,000 .mu..OMEGA.-cm to a resistivity of less than 1,000 .mu..OMEGA.-cm during a bonding process.

An electrical device comprising:

• a plurality of pads positioned on said electrical device for making electrical interconnections thereto, each said pad having an electrically conductive surface, and
• a substantially electrically conductive first composite adhered to said pads, said electrically conductive first composite comprises thermoplastic polymeric binder and at least about 30% by volume of conductive metal particles based on the total volume of said metal particles and said thermoplastic polymer, said electrically conductive first composite having a glass transition temperature in the range from about 100.degree. C. to about 240.degree. C.

An electrical device comprising:

• a plurality of pads positioned on said electrical device for making electrical interconnections thereto, each said pad having an electrically conductive surface, and
• a substantially electrically conductive first composite adhered to said pads, said electrically conductive first composite comprises thermoplastic polymeric binder and at least about 30% by volume of conductive metal particles based on the total volume of said metal particles and said thermoplastic polymer, and
• a second composite positioned over corresponding ones of said first composite forming an electrical and mechanical joint, said second composite having a glass transition temperature in the range from about 150.degree. C. to about 250.degree. C.