Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps

A method for forming solder bumps comprising:

• applying a solder paste to a member having a plurality of electrodes, wherein the solder paste is applied on the plurality of electrodes as well as in spaces between the plurality of electrodes, the solder paste contains solder particles and a volatile dispersion medium, and the solder paste is free of a flux;
• heating the member and the solder paste at a first temperature below a melting point of solder constituting the solder particles to volatilize the volatile dispersion medium in the solder paste, and forming a solder particle-containing layer on the member;
• heating the member and the solder particle-containing layer in a reducing atmosphere and at a second temperature equal to or higher than the melting point of the solder constituting the solder particles to melt the solder particles in the solder particle-containing layer, and forming solder bumps on the electrodes of the member;
• and
• removing, by cleaning, a residue of the solder particle-containing layer remaining between adjacent ones of the solder bumps, wherein the solder particles have an average particle size of 1.0 μm to 10 μm, and a content of the volatile dispersion medium in the solder paste is 30% by mass or more.