H10W 72/01265
Thermally treating
Official title: {Thermally treating (reflowing H10W72/01257)}
H10W72/01265 (Thermally treating) appears on 97 US grants and 118 published applications in this corpus.
Search patents in H10W- Granted patents
- 97
- Published applications
- 118
- Assignees
- 68
- Inventors
- 267
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 2 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 6 |
| 2011 | 3 | 5 |
| 2012 | 3 | 5 |
| 2013 | 3 | 6 |
| 2014 | 8 | 10 |
| 2015 | 13 | 14 |
| 2016 | 8 | 7 |
| 2017 | 8 | 10 |
| 2018 | 11 | 10 |
| 2019 | 8 | 6 |
| 2020 | 5 | 9 |
| 2021 | 4 | 11 |
| 2022 | 9 | 3 |
| 2023 | 1 | 6 |
| 2024 | 4 | 3 |
| 2025 | 4 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device21 Apr 2026US 12,609,507 B2Sony Semiconductor Solutions Corporation
- Expanded head pillar for bump bonds23 Dec 2025US 12,506,097 B2Texas Instruments Incorporated
- Fine-pitch joining pad structure8 Jul 2025US 12,354,983 B2International Business Machines Corporation
- Contact with bronze material to mitigate undercut25 Feb 2025US 12,237,219 B2Texas Instruments Incorporated
- Integrated circuit bond pad with multi-material toothed structure21 Jan 2025US 12,205,910 B2Microchip Technology Incorporated
- Method for forming copper pillars by copper paste screen printing10 Sep 2026US 2026/0271763 A1
- Electronic device6 Aug 2026US 2026/0229838 A1Sony Semiconductor Solutions Corporation
- Three-dimensional stacking semiconductor assemblies with near zero bond line thickness4 Jun 2026US 2026/0157236 A1Micron Technology, Inc.
- Semiconductor structure and method of making10 Jul 2025US 2025/0226342 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional stacking semiconductor assemblies with near zero bond line thickness24 Oct 2024US 2024/0355783 A1Micron Technology, Inc.
Most cited
By later US patents
- Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages32US 8,441,118 B2Intel Corporation · 2013
- 3D semiconductor package interposer with die cavity21US 9,780,072 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- 3D semiconductor package interposer with die cavity17US 9,385,095 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for making connection balls on electronic circuits or components15US 6,689,412 B1Societe Novatec S.A. · 2004
- Semiconductor device and method for manufacturing semiconductor device13US 8,008,182 B2Seiko Epson Corporation · 2011