3D semiconductor package interposer with die cavity
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung, Szu-Po Huang
Life of this patent
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Abstract
Disclosed herein is a method of forming a device, comprising mounting a plurality of first interconnects on one or more first integrated circuit dies. One or more second integrated circuit dies are mounted on a first side of an interposer. The interposer is mounted to at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer. The interposer is mounted to a first side of a substrate by attaching the first interconnects to the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects.
Claims20
A method of forming a device, comprising:
- mounting a plurality of first interconnects on one or more first integrated circuit dies;
- mounting one or more second integrated circuit dies on a first side of an interposer;
- mounting the interposer at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer;
- and
- mounting the interposer to a first side of a substrate by attaching the first interconnects to a major surface of the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects, wherein the first interconnects extend from the first integrated circuit dies to the substrate in substantially straight lines that are substantially perpendicular to the major surface of the substrate.
A method of forming a device, comprising:
- forming one or more first interconnects on one or more first integrated circuit dies;
- mounting one or more second integrated circuit dies on a first redistribution line (RDL) structure disposed at a first side of an interposer;
- forming a second RDL on the interposer, the second RDL separated from the first RDL by a middle layer;
- after forming one or more first interconnects on one or more first integrated circuit dies, mounting the interposer to the one or more first integrated circuit dies by attaching the one or more first integrated circuit dies to a first surface of the second RDL;
- and
- mounting the interposer to a substrate by attaching a first end of each of the one or more first interconnects to the substrate, a second end of each of the one or more first interconnects extending past the middle layer, the first RDL nearer the substrate than the second RDL, the substrate in signal communication with at least one of the one or more first integrated circuit dies through the one or more first interconnects.
A device, comprising:
- an interposer having a first redistribution line (RDL) structure disposed at a first side and a second RDL disposed at a second side opposite the first side, the first RDL separated from the second RDL by a middle layer;
- one or more first integrated circuit dies disposed on the second RDL;
- one or more second integrated circuit dies disposed on the first RDL;
- a substrate disposed under the interposer, the first RDL closer to the substrate than the second RDL;
- one or more first interconnects disposed outside of the interposer, each of the one or more first interconnects having a first end attached to the substrate and a second end extending past the middle layer, the substrate in signal communication with the one or more first integrated circuit dies by way of the one or more first interconnects;
- one or more first connectors disposed between, and electrically connecting, the interposer and second integrated circuit dies;
- and
- one or more second connectors disposed between and electrically connecting the first RDL and the substrate.
Dependencies are inferred from the claim text.