3D semiconductor package interposer with die cavity
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung, Szu-Po Huang
Life of this patent
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Abstract
Disclosed herein is a method of forming a device, comprising mounting a plurality of first interconnects on one or more first integrated circuit dies. One or more second integrated circuit dies are mounted on a first side of an interposer. The interposer is mounted at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer. The interposer is mounted to a first side of a substrate by attaching the first interconnects to the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects.
Claims20
A device, comprising:
- a substrate having a top surface;
- an interposer over the top surface of the substrate and having a first major surface facing the substrate, the interposer having a first redistribution line (RDL) disposed at the first major surface thereof and a second RDL disposed at a second major surface thereof opposite the first major surface;
- a first integrated circuit die mounted to the second RDL;
- a second integrated circuit die mounted to the first RDL;
- an interconnect extending outside a periphery of the interposer, the interconnect electrically connecting the substrate to the first integrated circuit die, the interconnect being physically isolated from the interposer;
- a first connector electrically connecting the interposer and the second integrated circuit die;
- and
- a second connector electrically connecting the first RDL and the substrate.
A device, comprising:
- a substrate having a top surface;
- an interposer over the top surface of the substrate, the interposer being connected to the substrate by a first plurality of connectors;
- a first integrated circuit die connected to a first side of the interposer by a second plurality of connectors;
- and
- a second integrated circuit die connected to a second side of the interposer opposite the first side by a third plurality of connectors and connected to the substrate by a fourth plurality of connectors, respective ones of the fourth plurality of connectors being disposed entirely outside a periphery of the interposer.
A device, comprising:
- a substrate having a top surface;
- an interposer over the top surface of the substrate, the interposer being connected to the substrate by first connectors;
- a plurality of first integrated circuit dies connected to a first side of the interposer by second connectors;
- and
- a second integrated circuit die connected to a second side of the interposer opposite the first side by third connectors, the second integrated circuit die having a smaller footprint than the interposer, the second integrated circuit die connected to the substrate by first interconnects that extend from the second integrated circuit die to the substrate in substantially straight lines perpendicular to a major surface of the interposer.
Dependencies are inferred from the claim text.