Method for making connection balls on electronic circuits or components

A process for making and soldering electrical connection beads (1) to electrical connection contact surfaces (2) of electronic circuits or components (3) using a first stencil (4) having a number of holes opposite said contact surfaces, with said stencil not being wettable by a molten paste and a solder paste deposited by silk-screening, comprising the steps of:

• placing the first stencil, with a thickness and hole dimensions determined by the pitch of the connection beads to be made and their diameter, on the substrate consisting of the circuit or electronic component, with the holes aligning with the contact surfaces;
• filling said holes with solder paste using a spreading tool, with the first stencil in place on the substrate;
• and
• performing a reflow with the first stencil in place on the substrate, wherein during the reflow the solder paste is heated forming molten metal beads and subsequently solidifying the molten metal beads to form the connection beads and wherein the first stencil (4) and the substrate are separated before solidification to form the connection beads while the molten metal beads are still in the liquid state, so that the connection beads being formed find their equilibrium position and their rigorously-identical spherical shape regardless of their numbers.