H10W 72/01208
Using permanent auxiliary members
Official title: {using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks}
H10W72/01208 (Using permanent auxiliary members) appears on 287 US grants and 325 published applications in this corpus.
Search patents in H10W- Granted patents
- 287
- Published applications
- 325
- Assignees
- 102
- Inventors
- 553
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 4 |
| 2009 | 2 | 4 |
| 2010 | 6 | 5 |
| 2011 | 3 | 4 |
| 2012 | 1 | 5 |
| 2013 | 2 | 8 |
| 2014 | 11 | 21 |
| 2015 | 24 | 54 |
| 2016 | 37 | 18 |
| 2017 | 26 | 31 |
| 2018 | 30 | 26 |
| 2019 | 26 | 26 |
| 2020 | 23 | 19 |
| 2021 | 22 | 23 |
| 2022 | 16 | 21 |
| 2023 | 16 | 16 |
| 2024 | 14 | 19 |
| 2025 | 9 | 12 |
| 2026 | 9 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and manufacturing method thereof7 Jul 2026US 12,677,698 B2Kioxia Corporation
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- 3D fan-out packaging structure of interconnection system with ultra-high density and method for manufacturing THE same1 Oct 2026US 2026/0305450 A1SJ Semiconductor(Jiangyin) Corporation
- Ring structure for interconnect structures and methods of forming the same11 Jun 2026US 2026/0165134 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device package and method for manufacturing the same22 Jan 2026US 2026/0026393 A1Advanced Semiconductor Engineering, Inc.
- Multi-chip packaging22 Jan 2026US 2026/0026411 A1Intel Corporation
Most cited
By later US patents
- TSV structures and methods for forming the same396US 8,803,316 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices269US 7,749,882 B2Micron Technology, Inc. · 2010
- Double solder bumps on substrates for low temperature flip chip bonding73US 8,987,132 B2International Business Machines Corporation · 2015
- Tall solders for through-mold interconnect44US 9,159,690 B2Intel Corporation · 2015
- Package-on-package (PoP) structure including stud bulbs and method39US 8,912,651 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014