Package-on-package (PoP) structure including stud bulbs and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Ming-Da Cheng
Life of this patent
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Abstract
Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.
Claims16
A structure comprising:
- a first substrate;
- stud bulbs coupled to a first surface of the first substrate, the stud bulbs comprising a first material composition;
- a die attached to the first surface of the first substrate;
- a second substrate;
- solder electrical connectors coupled to the second substrate, the solder electrical connectors comprising a second material composition, the second material composition being different from the first material composition, respective ones of the solder electrical connectors coupling respective ones of the stud bulbs;
- and
- respective ones of protection coatings on a surface of the respective ones of the stud bulbs, the respective ones of the protection coatings being between the respective ones of the stud bulbs and the respective ones of the solder electrical connectors, the protection coatings comprising a third material composition, the third material composition being different from the first material composition and the second material composition.
A structure comprising:
- a first substrate having a first pad on a first surface of the first substrate, a die being attached to the first surface of the first substrate;
- a second substrate having a second pad on a first surface of the second substrate;
- a stud bulb comprising a first material composition and on the first pad;
- a protection coating comprising a second material composition and on a surface of the stud bulb, the second material composition being different from the first material composition;
- and
- a solder connector comprising a third material composition and coupling the stud bulb to the second pad, the third material composition being different from the first material composition and the second material composition.
A structure comprising:
- a first bond pad on a first surface of a first substrate;
- a die attached to the first surface of the first substrate;
- a second bond pad on a second surface of a second substrate, the first surface opposing the second surface, the die being disposed between the first surface and the second surface;
- a stud bulb comprising a first material composition and on the first bond pad;
- a protection coating comprising a second material composition and on a surface of the stud bulb, the second material composition being different from the first material composition;
- and
- solder comprising a third material composition and mechanically coupling the protection coating to the second bond pad, the third material composition being different from the first material composition and the second material composition.
Dependencies are inferred from the claim text.