H10W 72/0198
Batch processes
Official title: {batch processes}
H10W72/0198 (Batch processes) appears on 18,119 US grants and 21,311 published applications in this corpus.
Search patents in H10W- Granted patents
- 18,119
- Published applications
- 21,311
- Assignees
- 2,075
- Inventors
- 19,635
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 9 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 9 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 9 | 0 |
| 1989 | 8 | 0 |
| 1990 | 17 | 0 |
| 1991 | 10 | 0 |
| 1992 | 14 | 0 |
| 1993 | 17 | 0 |
| 1994 | 28 | 0 |
| 1995 | 13 | 0 |
| 1996 | 19 | 0 |
| 1997 | 26 | 0 |
| 1998 | 46 | 0 |
| 1999 | 84 | 0 |
| 2000 | 87 | 0 |
| 2001 | 163 | 106 |
| 2002 | 214 | 325 |
| 2003 | 271 | 335 |
| 2004 | 291 | 398 |
| 2005 | 317 | 481 |
| 2006 | 276 | 429 |
| 2007 | 315 | 496 |
| 2008 | 273 | 575 |
| 2009 | 322 | 668 |
| 2010 | 506 | 626 |
| 2011 | 582 | 800 |
| 2012 | 591 | 893 |
| 2013 | 765 | 968 |
| 2014 | 886 | 1046 |
| 2015 | 980 | 1243 |
| 2016 | 1116 | 1109 |
| 2017 | 1147 | 1145 |
| 2018 | 1029 | 1137 |
| 2019 | 1142 | 1269 |
| 2020 | 1154 | 1449 |
| 2021 | 1102 | 1391 |
| 2022 | 1066 | 1409 |
| 2023 | 1008 | 919 |
| 2024 | 1010 | 864 |
| 2025 | 804 | 843 |
| 2026 | 353 | 387 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package including preformed support structure6 Oct 2026US 12,757,779 B2Samsung Electronics Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Method of manufacturing laminated assembly29 Sep 2026US 12,751,251 B2Disco Corporation
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and semiconductor package assembly with edge side interconnection29 Sep 2026US 12,751,308 B2Etron Technology, Inc.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314441 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015