H10W 72/019
Of bond pads
Official title: {of bond pads}
H10W72/019 (Of bond pads) appears on 9,308 US grants and 10,950 published applications in this corpus.
Search patents in H10W- Granted patents
- 9,308
- Published applications
- 10,950
- Assignees
- 1,193
- Inventors
- 12,352
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 6 | 0 |
| 1989 | 9 | 0 |
| 1990 | 8 | 0 |
| 1991 | 11 | 0 |
| 1992 | 17 | 0 |
| 1993 | 20 | 0 |
| 1994 | 27 | 0 |
| 1995 | 25 | 0 |
| 1996 | 26 | 0 |
| 1997 | 25 | 0 |
| 1998 | 46 | 0 |
| 1999 | 62 | 0 |
| 2000 | 78 | 0 |
| 2001 | 103 | 70 |
| 2002 | 160 | 173 |
| 2003 | 182 | 224 |
| 2004 | 179 | 245 |
| 2005 | 157 | 281 |
| 2006 | 163 | 276 |
| 2007 | 155 | 304 |
| 2008 | 178 | 379 |
| 2009 | 175 | 260 |
| 2010 | 244 | 351 |
| 2011 | 274 | 377 |
| 2012 | 304 | 446 |
| 2013 | 399 | 447 |
| 2014 | 446 | 528 |
| 2015 | 501 | 617 |
| 2016 | 535 | 527 |
| 2017 | 602 | 557 |
| 2018 | 507 | 507 |
| 2019 | 464 | 572 |
| 2020 | 534 | 685 |
| 2021 | 529 | 669 |
| 2022 | 499 | 579 |
| 2023 | 505 | 557 |
| 2024 | 483 | 540 |
| 2025 | 406 | 539 |
| 2026 | 234 | 240 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/01931Using blanket deposition3,119
- H10W 72/01951Changing the shapes of bond pads2,542
- H10W 72/01904Using temporary auxiliary members627
- H10W 72/01921Using local deposition275
- H10W 72/01971Cleaning218
- H10W 72/01908Using permanent auxiliary members202
- H10W 72/01961Chemical or physical modification174
Recent patents
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- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
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- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009