H10W 72/01904
Using temporary auxiliary members
Official title: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
H10W72/01904 (Using temporary auxiliary members) appears on 627 US grants and 730 published applications in this corpus.
Search patents in H10W- Granted patents
- 627
- Published applications
- 730
- Assignees
- 194
- Inventors
- 1,197
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 3 |
| 2003 | 3 | 4 |
| 2004 | 1 | 1 |
| 2005 | 3 | 4 |
| 2006 | 2 | 4 |
| 2007 | 2 | 7 |
| 2008 | 4 | 4 |
| 2009 | 2 | 4 |
| 2010 | 4 | 1 |
| 2011 | 3 | 14 |
| 2012 | 8 | 38 |
| 2013 | 19 | 35 |
| 2014 | 30 | 47 |
| 2015 | 46 | 56 |
| 2016 | 43 | 62 |
| 2017 | 70 | 49 |
| 2018 | 53 | 60 |
| 2019 | 53 | 65 |
| 2020 | 60 | 56 |
| 2021 | 47 | 54 |
| 2022 | 43 | 46 |
| 2023 | 47 | 35 |
| 2024 | 32 | 34 |
| 2025 | 33 | 28 |
| 2026 | 16 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Chip and wafer integration process using vertical connections388US 6,599,778 B2International Business Machines Corporation · 2003
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