Package structure and packaging method
AssigneeChangxin Memory Technologies, Inc.
InventorXiaoxuan Chen
Life of this patent
Estimating the term…
Abstract
A package structure includes at least two semiconductor structures that are stacked onto one another. The first surface of one semiconductor structure of the at least two semiconductor structures that are stacked onto one another directly faces toward the second surface of another semiconductor structure of the at least two semiconductor structures which is adjacent to said one semiconductor structure; the first metal layer of said one semiconductor structure is in contact with and bonded to the third metal layer of said another semiconductor structure; and the second metal layer of said one semiconductor structure is in contact with and bonded to the fourth metal layer of said another semiconductor structure.
Claims11
A package structure, comprising:
- at least two semiconductor structures that are stacked onto one another, each of the at least two semiconductor structures comprising a first surface and a second surface that are opposite to each other, each of the at least two semiconductor structures comprising a circuit area and a support area, and at least one conductive structure being disposed in the circuit area in each of the at least two semiconductor structures;
- each of the at least two semiconductor structures further comprising:
- at least one first metal layer and a second metal layer, the at least one first metal layer being located on the first surface in the circuit area, and the second metal layer being located on the first surface in the support area;
- at least one third metal layer and a fourth metal layer, the at least one third metal layer being located on the second surface in the circuit area and being electrically connected to the at least one conductive structure, and the fourth metal layer being located on the second surface in the support area,
- wherein the first surface of one semiconductor structure of the at least two semiconductor structures that are stacked onto one another directly faces toward the second surface of another semiconductor structure of the at least two semiconductor structures which is adjacent to said one semiconductor structure;
- the at least one first metal layer of said one semiconductor structure is contact with and bonded to the at least one third metal layer of said another semiconductor structure adjacent to said one semiconductor structure;
- and the second metal layer of said one semiconductor structure is in contact with and bonded to the fourth metal layer of said another semiconductor structure adjacent to said one semiconductor structure;
- and
- the at least one conductive structure protrudes from the second surface in the circuit area;
- each of the at least two semiconductor structures further comprises an insulating layer;
- the insulating layer is located on the second surface in the circuit area;
- the insulating layer is located on side surfaces of the at least one conductive structure;
- and the at least one third metal layer is located on a surface of the insulating layer.
Dependencies are inferred from the claim text.