H10W 72/01921
Using local deposition
Official title: {using local deposition}
H10W72/01921 (Using local deposition) appears on 275 US grants and 341 published applications in this corpus.
Search patents in H10W- Granted patents
- 275
- Published applications
- 341
- Assignees
- 139
- Inventors
- 661
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 4 |
| 2003 | 2 | 2 |
| 2004 | 3 | 2 |
| 2005 | 3 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 2 |
| 2008 | 0 | 6 |
| 2009 | 3 | 8 |
| 2010 | 5 | 7 |
| 2011 | 4 | 6 |
| 2012 | 5 | 19 |
| 2013 | 13 | 22 |
| 2014 | 19 | 26 |
| 2015 | 25 | 32 |
| 2016 | 25 | 29 |
| 2017 | 30 | 22 |
| 2018 | 19 | 17 |
| 2019 | 16 | 17 |
| 2020 | 17 | 26 |
| 2021 | 19 | 18 |
| 2022 | 10 | 17 |
| 2023 | 21 | 16 |
| 2024 | 12 | 18 |
| 2025 | 14 | 15 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor wafer23 Jun 2026US 12,666,895 B2Infineon Technologies AG
- Bond head with elastic material around perimeter to improve bonding quality16 Jun 2026US 12,660,698 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display device having a plurality of pad layers and method of manufacturing the same9 Jun 2026US 12,651,545 B2Samsung Display Co., Ltd.
- Display device and method of manufacturing the same1 Oct 2026US 2026/0301629 A1Samsung Display Co., Ltd.
- Package structure and method for manufacturing the same2 Jul 2026US 2026/0191012 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Fabricating the Same4 Jun 2026US 2026/0157166 A1United Microelectronics Corp.
- Pre-patterned adhesive tape for enabling double-sided circuit assembly30 Apr 2026US 2026/0123461 A1NXP USA, Inc.
- Method of joining electrical and mechanical components using laminated modular preforms30 Apr 2026US 2026/0123502 A1Alpha Assembly Solutions Inc.
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013