H10W 72/01923
In liquid form
Official title: {in liquid form, e.g. by dispensing droplets or by screen printing}
H10W72/01923 (In liquid form) appears on 158 US grants and 188 published applications in this corpus.
Search patents in H10W- Granted patents
- 158
- Published applications
- 188
- Assignees
- 90
- Inventors
- 367
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 3 |
| 2009 | 2 | 6 |
| 2010 | 3 | 3 |
| 2011 | 2 | 2 |
| 2012 | 3 | 11 |
| 2013 | 6 | 12 |
| 2014 | 8 | 15 |
| 2015 | 19 | 19 |
| 2016 | 14 | 17 |
| 2017 | 21 | 13 |
| 2018 | 11 | 10 |
| 2019 | 10 | 9 |
| 2020 | 9 | 14 |
| 2021 | 11 | 13 |
| 2022 | 9 | 11 |
| 2023 | 10 | 7 |
| 2024 | 9 | 10 |
| 2025 | 8 | 8 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor wafer23 Jun 2026US 12,666,895 B2Infineon Technologies AG
- Bond head with elastic material around perimeter to improve bonding quality16 Jun 2026US 12,660,698 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Industrial chip scale package for microelectronic device2 Dec 2025US 12,489,067 B2Texas Instruments Incorporated
- Method of fabricating a conductive layer on an IC using non-lithographic fabrication techniques1 Jul 2025US 12,347,800 B2Pragmatic Semiconductor Limited
- Package structure and method for manufacturing the same2 Jul 2026US 2026/0191012 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Industrial chip scale package for microelectronic device19 Mar 2026US 2026/0082927 A1
- Liquid metal interconnects for power semiconductor modules11 Dec 2025US 2025/0379167 A1The Board of Trustees of The University of Alabama
- Inkjet printing of diffusion solder25 Sep 2025US 2025/0300127 A1Infineon Technologies Austria AG
- Conductive buffer layers for semiconductor die assemblies and associated systems and methods4 Sep 2025US 2025/0279379 A1Micron Technology, Inc.
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014