Industrial chip scale package for microelectronic device
OwnerSreenivasan K. Koduriinventor
Life of this patent
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Abstract
A microelectronic device includes a die with input/output (I/O) terminals, and a dielectric layer on the die. The microelectronic device includes electrically conductive pillars which are electrically coupled to the I/O terminals, and extend through the dielectric layer to an exterior of the microelectronic device. Each pillar includes a column electrically coupled to one of the I/O terminals, and a head contacting the column at an opposite end of the column from the I/O terminal. The head extends laterally past the column in at least one lateral direction. Methods of forming the pillars and the dielectric layer are disclosed.
Claims16
A microelectronic device, comprising:
- a die;
- at least one input/output (I/O) terminal on the die;
- a dielectric layer on the die;
- at least one column in the dielectric layer and electrically coupled to the at least one I/O terminal;
- a head in the dielectric layer and electrically coupled to the at least one column;
- a first barrier layer and a second barrier layer on the head;
- and
- an isolation layer on the head between the first barrier layer and the second barrier layer.
An apparatus, comprising:
- a microelectronic device and a substrate coupled to the microelectronic device, wherein:
- the microelectronic device comprises:
- a die;
- at least one input/output (I/O) terminal on the die;
- a dielectric layer on the die;
- at least one column in the dielectric layer and electrically coupled to the at least one I/O terminal;
- a head in the dielectric layer and electrically coupled to the at least one column;
- a first barrier layer and a second barrier layer on the head;
- a first solder layer on the first barrier layer and a second solder layer on the second barrier layer;
- and
- an isolation layer on the head and between the first barrier layer and the second barrier layer;
- and
- the substate comprises:
- an insulator layer;
- and
- a first pad, a second pad, and a third pad on the insulator layer,
- and wherein the first pad is coupled to the first solder layer and the second pad is coupled to and the second solder layer, the third pad is between the first pad and the second pad, and the isolation layer is between the third pad and the head.
A microelectronic device, comprising:
- a die;
- at least one input/output (I/O) terminal on the die;
- a dielectric layer on the die;
- at least one column in the dielectric layer and electrically coupled to the at least one I/O terminal ;
- and
- at least one head on the at least one column, wherein the at least one head comprises a peripheral portion having a curved contour.
Dependencies are inferred from the claim text.