Bond head with elastic material around perimeter to improve bonding quality
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chih-Hang Tung, Kuo-Chung Yee, Yian-Liang Kuo, Jiun-Yi Wu
Life of this patent
Estimating the term…
Abstract
A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.
Claims20
A bond head, comprising:
- a bond base;
- a chuck member protruding from a surface of the bond base, wherein the chuck member has a chuck surface formed with vacuum holes for holding a die using differential air pressure, wherein in a direction parallel to the chuck surface, a width of the chuck surface is less than a width of the bond base and is equal to or greater than a width of the die;
- and
- an elastic material disposed over the chuck surface, wherein the elastic material is arranged around a periphery of the chuck surface to cover edges and/or corners of the chuck surface, and
- wherein the elastic material also includes a center portion covering a central region of the chuck surface, and the center portion of the elastic material is thicker than a remainder of the elastic material.
A bond head, comprising:
- a bond base;
- a chuck member protruding from a surface of the bond base, wherein the chuck member has a chuck surface with vacuum holes formed therein for holding a die using vacuum force, wherein in a plan view, a cross-sectional view area of the chuck surface is equal to or greater than a cross-sectional view area of the die;
- and
- an elastic material disposed over the chuck surface, wherein the elastic material is arranged around a periphery of the chuck surface, and
- wherein the elastic material also includes a center portion covering a central region of the chuck surface, and the center portion of the elastic material is thicker than a remainder of the elastic material.
A bond head, comprising:
- a bond base;
- a chuck member protruding from a surface of the bond base, wherein the chuck member has a chuck surface with vacuum holes formed therein for holding a die using vacuum force, wherein the chuck member is located in a central region of the bond base and is spaced apart from a periphery of the bond base, wherein there is a groove proximate to the periphery of the bond base and around a sidewall of the chuck member;
- and
- an elastic material disposed over the chuck surface, wherein the elastic material is arranged around a periphery of the chuck surface and further extends into the groove, and
- wherein the elastic material also includes a center portion covering a central region of the chuck surface, and the center portion of the elastic material is thicker than a remainder of the elastic material.
Dependencies are inferred from the claim text.