Industrial chip scale package for microelectronic device
AssigneeTexas Instruments Incorporated
InventorSreenivasan K Koduri
Life of this patent
Estimating the term…
Abstract
A microelectronic device includes a die with input/output (I/O) terminals, and a dielectric layer on the die. The microelectronic device includes electrically conductive pillars which are electrically coupled to the I/O terminals, and extend through the dielectric layer to an exterior of the microelectronic device. Each pillar includes a column electrically coupled to one of the I/O terminals, and a head contacting the column at an opposite end of the column from the I/O terminal. The head extends laterally past the column in at least one lateral direction. Methods of forming the pillars and the dielectric layer are disclosed.
Claims18
A microelectronic device, comprising:
- a die;
- a first input/output (I/O) terminal and a second I/O terminal on the die;
- a dielectric layer on the die;
- a first column electrically coupled to the first I/O terminal and a second column electrically coupled to the second I/O terminal;
- and
- a head electrically coupled to both the first column and the second column at an opposite end of each of the first and second columns from the first and second I/O terminals, the head extending through the dielectric layer, a portion of the head exposed from a surface of the microelectronic device, wherein the first I/O terminal and the second I/O terminal are on a same side of the die.
An interconnect structure, comprising:
- a dielectric layer;
- a first column electrically coupled to a first contact on a die and a second column electrically coupled to a second contact on the die, the first contact and the second contact on a same side of the die;
- and
- a head electrically coupled to both the first column and the second column at an opposite end of each of the first and second columns from the first and second contacts, the head extending through the dielectric layer, a portion of the head exposed from a surface of the dielectric layer.
Dependencies are inferred from the claim text.