H10W 72/01961
Chemical or physical modification
Official title: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01951)}
H10W72/01961 (Chemical or physical modification) appears on 174 US grants and 209 published applications in this corpus.
Search patents in H10W- Granted patents
- 174
- Published applications
- 209
- Assignees
- 96
- Inventors
- 494
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 1 | 5 |
| 2008 | 0 | 3 |
| 2009 | 2 | 4 |
| 2010 | 4 | 4 |
| 2011 | 3 | 5 |
| 2012 | 5 | 7 |
| 2013 | 5 | 10 |
| 2014 | 11 | 9 |
| 2015 | 8 | 12 |
| 2016 | 8 | 11 |
| 2017 | 10 | 12 |
| 2018 | 11 | 12 |
| 2019 | 9 | 10 |
| 2020 | 18 | 24 |
| 2021 | 11 | 18 |
| 2022 | 24 | 14 |
| 2023 | 7 | 9 |
| 2024 | 16 | 15 |
| 2025 | 7 | 9 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure and method for manufacturing same, semiconductor device4 Aug 2026US 12,702,045 B2Changxin Memory Technologies, Inc.
- Semiconductor device and method of manufacturing the same16 Jun 2026US 12,660,669 B2Advanced Semiconductor Engineering, Inc.
- Methods and devices for improving bond strength of diffusion barriers26 May 2026US 12,642,154 B2Tokyo Electron Limited
- Connector formation methods and packaged semiconductor devices19 May 2026US 12,635,507 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor die package14 Apr 2026US 12,604,752 B2Infineon Technologies Austria AG
- Semiconductor device and method of manufacturing semiconductor device1 Oct 2026US 2026/0305444 A1Mitsubishi Electric Corporation
- Method for polishing a resin film, and method for manufacturing a circuit connection body10 Sep 2026US 2026/0271764 A1Resonac Corporation
- Semiconductor devices with selectively disabled bond pads for cascade wire bonding20 Aug 2026US 2026/0248047 A1Micron Technology, Inc.
- Method for manufacturing component, component, and hybrid bonding equipment30 Jul 2026US 2026/0223730 A1Panasonic Intellectual Property Management Co., Ltd.
- Pre-clean and dry sam application to improve hybrid bonding reliability and electrical performance11 Jun 2026US 2026/0165182 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Increased contact alignment tolerance for direct bonding214US 9,852,988 B2Invensas Bonding Technologies, Inc. · 2017
- Increased contact alignment tolerance for direct bonding53US 10,269,708 B2Invensas Bonding Technologies, Inc. · 2019
- Method of manufacturing an integrated ULSI heatsink40US 5,773,362 AInternational Business Machines Corporation · 1998
- Screen print under-bump metalization (UBM) to produce low cost flip chip substrate33US 6,992,001 B1Kulicke and Soffa Industries, Inc. · 2006
- Screenable contact structure and method for semiconductor devices31US 4,293,451 A1981