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US 2026/0271764 A1Published application
Method for polishing a resin film, and method for manufacturing a circuit connection body
AssigneeResonac Corporation
InventorsTetsuya OGAWA, Shintaro NAGAYAMA, Taira ONUMA
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Abstract
A method for polishing a resin film, comprising: semi-curing a thermosetting resin film comprising a maleimide compound having a maleimide group, by heat treatment; and polishing the semi-cured resin film by chemical mechanical polishing while supplying an abrasive comprising silica particles. A method for manufacturing a circuit connection body, comprising polishing a resin film.
Claims8
A method for polishing a resin film, comprising:
- semi-curing a thermosetting resin film comprising a maleimide compound having a maleimide group, by heat treatment;
- and
- polishing the semi-cured resin film by chemical mechanical polishing while supplying an abrasive comprising silica particles.
Dependencies are inferred from the claim text.