Back to results
US 12,604,752 B2Granted
Semiconductor die package
AssigneeInfineon Technologies Austria AG
InventorsEdward Fürgut, Irmgard Escher-Poeppel, Martin Gruber, Ivan Nikitin, Hans-Joachim Schulze
Life of this patent
Estimating the term…
Abstract
A semiconductor die package includes a semiconductor transistor die having a contact pad on an upper main face. The semiconductor die package also includes an electrical conductor disposed on the contact pad and fabricated by laser-assisted structuring of a metallic material, and an encapsulant covering the semiconductor die and at least a portion of the electrical conductor.
Claims18
A semiconductor die package, comprising:
- a semiconductor transistor die, the semiconductor transistor die comprising a contact pad on an upper main face;
- an electrical conductor disposed on the contact pad, the electrical conductor comprising a laser irradiated metallic material that forms a uniform and coherent block;
- and
- an encapsulant covering the semiconductor die and at least a portion of the electrical conductor.
1 more element
Dependencies are inferred from the claim text.