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US 6,992,001 B1Granted
Screen print under-bump metalization (UBM) to produce low cost flip chip substrate
AssigneeKulicke and Soffa Industries, Inc.
InventorPaul T. Lin
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Abstract
A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducing atmosphere at an elevated temperature to form an under-bump metalization layer of an interconnect pad. The elevated temperature is below a melting temperature of the terminal metalization pad.
Claims18
A method of processing an integrated circuit comprising the steps of:
- removing a metal oxide from a terminal metallization pad of the integrated circuit;
- screen printing a conductive paste onto the terminal metalization pad of the integrated circuit;
- curing the conductive paste in an inert or reducing atmosphere at an elevated temperature while the conductive paste is in conductive contact with the terminal metallization pad to form an under-bump metalization layer of an interconnect pad, the interconnect pad including the terminal metallization pad and the under-bump metalization layer;
- wherein the elevated temperature is below a melting temperature of the terminal metalization pad;
- applying a solder material on the interconnect pad;
- and
- reflowing the solder material at a reflow temperature to form a solder bump.
4 more elements
Dependencies are inferred from the claim text.