H10W 72/01971
Cleaning
Official title: {Cleaning, e.g. oxide removal}
H10W72/01971 (Cleaning) appears on 218 US grants and 269 published applications in this corpus.
Search patents in H10W- Granted patents
- 218
- Published applications
- 269
- Assignees
- 91
- Inventors
- 498
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 2 |
| 2003 | 3 | 4 |
| 2004 | 2 | 3 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 2 | 8 |
| 2008 | 3 | 3 |
| 2009 | 4 | 2 |
| 2010 | 1 | 3 |
| 2011 | 2 | 7 |
| 2012 | 4 | 8 |
| 2013 | 12 | 12 |
| 2014 | 12 | 25 |
| 2015 | 14 | 24 |
| 2016 | 25 | 23 |
| 2017 | 21 | 20 |
| 2018 | 17 | 29 |
| 2019 | 16 | 22 |
| 2020 | 20 | 10 |
| 2021 | 15 | 20 |
| 2022 | 9 | 7 |
| 2023 | 10 | 10 |
| 2024 | 10 | 11 |
| 2025 | 8 | 6 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Strong bonding structures and methods of forming the same15 Sep 2026US 12,740,487 B2Adeia Semiconductor Bonding Technologies Inc.
- Bonding structure with stress buffer zone and method of forming same31 Mar 2026US 12,593,711 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate arrangement and manufacturing method for a micro display24 Mar 2026US 12,588,376 B2Infineon Technologies AG
- Wafer-level-package device with peripheral side wall protection3 Mar 2026US 12,568,844 B2Panjit International Inc.
- Thermocompression bonding with passivated gold contacting metal15 Jul 2025US 12,363,877 B2SET North America, LLC
- Manufacturing method for a micro display25 Jun 2026US 2026/0182188 A1Infineon Technologies AG
- Plasma assisted metal oxide reduction during die-to-wafer anneal11 Jun 2026US 2026/0160496 A1Tokyo Electron Limited
- Pre-clean and dry sam application to improve hybrid bonding reliability and electrical performance11 Jun 2026US 2026/0165182 A1APPLIED Materials.Inc.
- Self-aligned die-to-wafer bonding architecture4 Jun 2026US 2026/0157224 A1SanDisk Technologies LLC
- Semiconductor device and method for fabricating the same7 May 2026US 2026/0130177 A1United Microelectronics Corp.
Most cited
By later US patents
- Method for wafer-wafer bonding238US 9,941,241 B2International Business Machines Corporation · 2018
- Processed stacked dies172US 10,879,212 B2Invensas Bonding Technologies, Inc. · 2020
- Integrated system and method of making the integrated system56US 9,704,843 B2Infineon Technologies AG · 2017
- Dual layer stack for contact formation48US 9,401,336 B2International Business Machines Corporation · 2016
- Thin film device and method of manufacturing the same42US 6,503,778 B1Sony Corporation · 2003