Substrate arrangement and manufacturing method for a micro display

A substrate arrangement comprising:

• a semiconductor substrate;
• a back end of line (BEOL) stack arranged on the semiconductor substrate, the BEOL stack comprising:
• a plurality of structured wiring layers;
• an insulating material structure (IMS);
• a recess in the IMS,
• wherein the plurality of structured wiring layers are stacked and embedded in the insulating material structure,
• wherein an upmost structured wiring layer of the plurality of structured wiring layers comprises a plurality of contact pads,
• wherein the recess extends through the IMS on a top surface of the BEOL stack to a first set of contact pads of the plurality of contact pads;
• and
• a conductive metal layer arranged on the top surface of the BEOL stack,
• wherein the conductive metal layer comprises a first, structured portion comprising a contact pad array,
• wherein the conductive metal layer comprises a second portion that is arranged on the first set of contact pads of the BEOL stack,
• wherein the first portion of the conductive metal layer is electrically separated from the second portion of the conductive metal layer, and
• wherein the first set of contact pads of the BEOL stack and the second portion of the conductive metal layer form recessed wire-bond pads.