Manufacturing method for a micro display

A method comprising:

• providing a substrate arrangement having a back end of line (BEOL) stack on a semiconductor substrate, wherein the BEOL stack comprises a plurality of structured wiring layers stacked and embedded in an insulating material structure (IMS), and wherein an upmost structured wiring layer of the plurality of structured wiring layers comprises a plurality of contact pads;
• after providing the substrate arrangement, locally removing portions of the IMS for exposing a first set of contact pads of the plurality of contact pads of the upmost structured wiring layer;
• and
• after locally removing portions of the IMS, depositing a conductive layer comprising a metallic material on a surface of the BEOL stack and structuring the conductive layer to provide a first structured portion of the conductive layer comprising a contact pad array and a second portion of the conductive layer that is arranged on the first set of contact pads of the BEOL stack,
• wherein the first portion of the conductive layer is electrically separated from the second portion of the conductive layer, and
• wherein the first set of contact pads of the BEOL stack and the second portion of the conductive layer form recessed wire-bond pads.