H10W 72/01931
Using blanket deposition
Official title: {using blanket deposition}
H10W72/01931 (Using blanket deposition) appears on 3,119 US grants and 3,788 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,119
- Published applications
- 3,788
- Assignees
- 542
- Inventors
- 4,845
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 4 |
| 2002 | 4 | 7 |
| 2003 | 7 | 11 |
| 2004 | 5 | 7 |
| 2005 | 8 | 11 |
| 2006 | 7 | 14 |
| 2007 | 5 | 14 |
| 2008 | 5 | 24 |
| 2009 | 9 | 25 |
| 2010 | 24 | 47 |
| 2011 | 26 | 91 |
| 2012 | 62 | 208 |
| 2013 | 132 | 207 |
| 2014 | 183 | 248 |
| 2015 | 228 | 307 |
| 2016 | 257 | 265 |
| 2017 | 289 | 279 |
| 2018 | 251 | 228 |
| 2019 | 229 | 258 |
| 2020 | 246 | 329 |
| 2021 | 254 | 308 |
| 2022 | 248 | 261 |
| 2023 | 205 | 169 |
| 2024 | 198 | 186 |
| 2025 | 150 | 188 |
| 2026 | 76 | 92 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Submounts with stud protrusions for semiconductor packages29 Sep 2026US 12,751,305 B2
- Molded thin semiconductor die packages and related methods22 Sep 2026US 12,745,662 B2Semiconductor Components Industries, LLC
- Substrate and method of manufacturing the same22 Sep 2026US 12,745,665 B2Samsung Electro-Mechanics Co., Ltd.
- Semiconductor device manufacturing method and semiconductor device manufactured using the same15 Sep 2026US 12,740,173 B2Samsung Electronics Co., Ltd.
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor die package and methods of manufacturing8 Oct 2026US 2026/0314505 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014