H10W 72/01938
In gaseous form
Official title: {in gaseous form, e.g. by CVD or PVD}
H10W72/01938 (In gaseous form) appears on 1,956 US grants and 2,331 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,956
- Published applications
- 2,331
- Assignees
- 397
- Inventors
- 3,158
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 2 |
| 2003 | 3 | 3 |
| 2004 | 1 | 5 |
| 2005 | 4 | 7 |
| 2006 | 3 | 5 |
| 2007 | 4 | 10 |
| 2008 | 5 | 11 |
| 2009 | 6 | 12 |
| 2010 | 13 | 25 |
| 2011 | 13 | 56 |
| 2012 | 40 | 136 |
| 2013 | 74 | 116 |
| 2014 | 116 | 167 |
| 2015 | 142 | 216 |
| 2016 | 174 | 181 |
| 2017 | 193 | 181 |
| 2018 | 181 | 147 |
| 2019 | 140 | 181 |
| 2020 | 163 | 209 |
| 2021 | 172 | 184 |
| 2022 | 145 | 147 |
| 2023 | 116 | 86 |
| 2024 | 118 | 94 |
| 2025 | 89 | 104 |
| 2026 | 34 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Electronic devices and methods of manufacturing electronic devices18 Aug 2026US 12,713,952 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Semiconductor device and manufacturing method of semiconductor device24 Sep 2026US 2026/0293746 A1Denso Corporation
- Semiconductor device and method for manufacturing same17 Sep 2026US 2026/0282505 A1
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014