H10W 72/01936
In solid form
Official title: {in solid form, e.g. by using a powder or by laminating a foil}
H10W72/01936 (In solid form) appears on 63 US grants and 81 published applications in this corpus.
Search patents in H10W- Granted patents
- 63
- Published applications
- 81
- Assignees
- 39
- Inventors
- 155
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 2 | 2 |
| 2002 | 3 | 1 |
| 2003 | 1 | 2 |
| 2004 | 2 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 5 |
| 2011 | 1 | 3 |
| 2012 | 2 | 5 |
| 2013 | 2 | 6 |
| 2014 | 3 | 7 |
| 2015 | 6 | 5 |
| 2016 | 4 | 10 |
| 2017 | 9 | 5 |
| 2018 | 5 | 3 |
| 2019 | 4 | 3 |
| 2020 | 2 | 4 |
| 2021 | 3 | 5 |
| 2022 | 2 | 0 |
| 2023 | 4 | 6 |
| 2024 | 1 | 3 |
| 2025 | 2 | 0 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor die package14 Apr 2026US 12,604,752 B2Infineon Technologies Austria AG
- Semiconductor device and method of manufacturing the same27 Jan 2026US 12,538,826 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package comprising an interconnection die located between substrates16 Dec 2025US 12,500,187 B2QUALCOMM Incorporated
- Electronic device with multi-layer contact and system18 Mar 2025US 12,255,168 B2Infineon Technologies AG
- Semiconductor die singulation23 Jan 2024US 11,881,434 B2Texas Instruments Incorporated
- Substrate assembly with surface structure17 Sep 2026US 2026/0282995 A1Heraeus Electronics GmbH & Co. KG
- Semiconductor device and method of manufacturing the same28 Nov 2024US 2024/0395743 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and power converting device15 Aug 2024US 2024/0274557 A1Mitsubishi Electric Corporation
- Electronic device with multi-layer contact and system14 Mar 2024US 2024/0088087 A1Infineon Technologies AG
- Chip package21 Dec 2023US 2023/0411317 A1Walton Advanced Engineering Inc.
Most cited
By later US patents
- Chip scale package and method for manufacturing the same using a redistribution substrate162US 6,235,552 B1Samsung Electronics Co., Ltd. · 2001
- Transfer wafer level packaging142US 6,727,576 B2Infineon Technologies AG · 2004
- Semiconductor die including conductive columns81US 6,683,375 B2Fairchild Semiconductor Corporation · 2004
- Embedding thin chips in polymer53US 9,171,794 B2MC10, Inc. · 2015
- Method for making a semiconductor die package50US 7,022,548 B2Fairchild Semiconductor Corporation · 2006