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AssigneeInfineon Technologies AG
InventorsAlexander Heinrich, Michael Juerss, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt
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An electronic device with a multi-layer contact and a system is disclosed. In an embodiment, a semiconductor device includes a semiconductor substrate having a first electrode terminal located on a first surface and a second surface electrode terminal located on a second surface, the first surface being opposite to the second surface, an electrical contact layer disposed directly on the first electrode terminal, a functional layer directly disposed on the electrical contact layer, an adhesion layer directly disposed on the functional layer, a solder layer directly disposed on the adhesion layer; and a protection layer directly disposed on the solder layer, wherein the semiconductor device is a power semiconductor device configured to provide a vertical current flow.
A system comprising:
Dependencies are inferred from the claim text.