Method for making a semiconductor die package

A method for forming a semiconductor die package, the method comprising:

• a) forming a passivation layer comprising a first aperture on a conductive region on a semiconductor substrate, wherein the aperture in the mask is disposed over the conductive region;
• b) forming an adhesion layer on the passivation layer and on the conductive region;
• c) forming a seed layer on the adhesion layer;
• d) forming a patterned photoresist layer comprising a second aperture on the passivation layer, wherein the second aperture is over the conductive region and is aligned with the first aperture;
• e) electroplating a conductive layer within the second aperture and on the seed layer;
• f) depositing solder paste containing a flux within the second aperture and on the electroplated conductive layer;
• g) inserting a pre-formed conductive column into the second aperture;
• h) placing the pre-formed conductive column on the conductive layer within the second aperture;
• i) removing the patterned photoresist layer;
• j) etching portions of the adhesion layer and the seed layer disposed around the bonded pre-formed conductive column;
• and
• k) heating the solder paste to bond the pre-formed conductive column to the conductive region on the semiconductor substrate.