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US 9,171,794 B2Granted
Embedding thin chips in polymer
AssigneeMC10, Inc.
InventorsConor Rafferty, Mitul Dalal
Life of this patent
Estimating the term…
Abstract
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
Claims56
An apparatus comprising:
- A) a substrate comprising a standoff well region, wherein:
- the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer, wherein the flexible polymer is further stretchable;
- and
- a patterned portion of the first conductive material comprises a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region;
- B) a thin chip disposed within the standoff well region on a portion of the exposed flexible polymer proximate to the standoff;
- and
- C) an adhesive material disposed within the standoff well region at a portion of the exposed flexible polymer proximate to the standoff, the thin chip being disposed on the adhesive material proximate the standoff, the adhesive material including a conductive adhesive,
- wherein a height of the standoff is comparable to a height of the thin chip.
5 more elements
A method for embedding thin chips, the method comprising:
- A) providing a substrate comprising a standoff well region, wherein:
- the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer, wherein the flexible polymer is further stretchable;
- and
- at least a portion of the first conductive material is patterned to form a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region;
- B) disposing a conductive adhesive material within the standoff well region at a portion of the exposed flexible polymer proximate to the standoff;
- and
- C) disposing a thin chip on a portion of the exposed flexible polymer proximate to the standoff such that a height of the standoff is comparable to a height of the thin chip, the thin chip being disposed on the conductive adhesive material proximate to the standoff.
4 more elements
An apparatus comprising:
- A) a substrate comprising a polymer well region, wherein:
- the substrate comprises a layer of a flexible polymer disposed on a layer of a first conductive material, wherein the flexible polymer is further stretchable;
- a cavity is formed in at least a portion of the flexible polymer to form at least one polymer wall bordering a portion of exposed first conductive material, thereby forming the polymer well region;
- B) a thin chip disposed within the polymer well region on at least a portion of the exposed first conductive material proximate to the at least one polymer wall;
- and
- C) an adhesive material disposed within the polymer well region at a portion of the exposed first conductive material proximate to the at least one polymer wall, the adhesive material including a conductive adhesive, the thin chip being disposed on the adhesive material proximate to the at least one polymer wall.
3 more elements
A method for embedding thin chips, the method comprising:
- A) providing a substrate comprising a polymer well region, the substrate comprising a layer of a flexible polymer and a layer of a first conductive material, the flexible polymer further being stretchable, the polymer well region comprising at least one polymer wall formed from a portion of the flexible polymer and a base region formed from at least a portion of the first conductive material;
- B) disposing an adhesive material at the portion of the first conductive proximate to the at least one polymer wall, the adhesive material including a conductive adhesive;
- and
- C) disposing the thin chip within the polymer well region on a portion of the first conductive material proximate to the at least one polymer wall, the thin chip being disposed on the adhesive material proximate to the at least one polymer wall.
1 more element
Dependencies are inferred from the claim text.