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US 6,727,576 B2Granted
Transfer wafer level packaging
AssigneeInfineon Technologies AG
InventorsHarry Hedler, Thorsten Meyer, Barbara Vasquez
Life of this patent
Estimating the term…
Abstract
A semiconductor structure and a method for forming the semiconductor structure, including a semiconductor chip and a conductive layer disposed over a portion of the chip, the conductive layer having a portion that extends beyond an edge of the chip. The chip includes a device, which can be an integrated circuit or a micro-mechanical device. The structure can also include a front layer extending beyond the edge of the chip, the conductive layer being disposed on the front layer.
Claims16
A semiconductor structure, comprising:
- a semiconductor chip having an edge and a surface;
- a contact pad disposed on the surface of the semiconductor chip;
- and
- a conductive layer disposed on the surface of the semiconductor chip and in contact with the contact pad, the conductive layer having a portion that extends beyond the edge of the semiconductor chip.
1 more element
A semiconductor structure, comprising:
- a semiconductor chip having a surface and an edge;
- a contact pad disposed on the surface of the semiconductor chip;
- and
- a front layer, having a first portion disposed on the surface of the semiconductor chip, and a second portion extending beyond the edge of the chip.
1 more element
Dependencies are inferred from the claim text.