Back to results
US 12,500,187 B2Granted
Package comprising an interconnection die located between substrates
AssigneeQUALCOMM Incorporated
InventorsYangyang Sun, Zhijie Wang, Wei Wang, Marcus Hsu
Life of this patent
Estimating the term…
Abstract
A package comprising a first substrate; a first integrated device coupled to the first substrate; an interconnection die coupled to the first substrate; a second substrate coupled to the first substrate through the interconnection die such that the first integrated device and the interconnection die are located between the first substrate and the second substrate; and an encapsulation layer coupled to the first substrate and the second substrate, wherein the encapsulation layer is located between the first substrate and the second substrate.
Claims25
A package comprising:
- a first substrate comprising:
- at least one first dielectric layer;
- and
- a first plurality of interconnects;
- a first integrated device coupled to the first substrate;
- an interconnection die coupled to the first substrate through a first plurality of solder interconnects;
- a second substrate located over the first substrate, the interconnection die, and the first integrated device, the second substrate coupled to the first substrate through the interconnection die such that the first integrated device and the interconnection die are located between the first substrate and the second substrate,
- wherein the second substrate comprises:
- at least one second dielectric layer;
- and
- a second plurality of interconnects;
- and
- wherein the second substrate is coupled to the interconnection die through a second plurality of solder interconnects,
- an encapsulation layer coupled to the first substrate and the second substrate, wherein the encapsulation layer is located between the first substrate and the second substrate;
- wherein the interconnection die is located laterally to the first integrated device.
12 more elements
A device comprising:
- a first package comprising:
- a first substrate comprising:
- at least one first dielectric layer;
- and
- a first plurality of interconnects;
- a first integrated device coupled to the first substrate;
- means for die interconnection coupled to the first substrate coupled to the first substrate through a first plurality of solder interconnects;
- a second substrate located over the first substrate, the means for die interconnection, and the first integrated device, the second substrate coupled to the first substrate through the means for die interconnection such that the first integrated device and the means for die interconnection are located between the first substrate and the second substrate,
- wherein the second substrate comprises:
- at least one second dielectric layer;
- and
- a second plurality of interconnects;
- and
- wherein the second substrate is coupled to the means for die interconnection through a second plurality of solder interconnects,
- an encapsulation layer coupled to the first substrate and the second substrate, wherein the encapsulation layer is located between the first substrate and the second substrate;
- wherein the interconnection die is located laterally to the first integrated device.
13 more elements
A method for fabricating a package, comprising:
- providing a first substrate comprising a first surface and a second surface, wherein the first substrate comprises a least one first dielectric layer and a first plurality of interconnects;
- coupling a first integrated device to the second surface of the first substrate;
- coupling an interconnection die to the second surface of the first substrate through a first plurality of solder interconnects;
- coupling a second substrate to the first substrate through the interconnection die,
- wherein the second substrate comprises a first surface and a second surface,
- wherein the second substrate comprises at least one second dielectric layer and a second plurality of interconnects, and
- wherein the second substrate is located over the first substrate, the interconnection die, and the first integrated device such that the first integrated device and the interconnection die are located between the first substrate and the second substrate, and
- wherein the second substrate is coupled to the interconnection die through a second plurality of solder interconnects;
- and
- forming an encapsulation layer between the first substrate and the second substrate.
7 more elements
Dependencies are inferred from the claim text.