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US 6,683,375 B2Granted
Semiconductor die including conductive columns
AssigneeFairchild Semiconductor Corporation
InventorsRajeev Joshi, Chung-Lin Wu
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Abstract
A method for processing a semiconductor substrate is disclosed. The method includes providing a mask having an aperture on a semiconductor substrate having a conductive region. An aperture in the mask is disposed over the conductive region. A pre-formed conductive column is placed in the aperture and is bonded to the conductive region.
Claims9
A semiconductor die package comprising:
- a) a semiconductor die;
- b) a conductive region on the semiconductor die;
- c) a passivation layer comprising an aperture on the semiconductor die, wherein the aperture is disposed over the conductive region;
- and
- d) a solid pre-formed, conductive column on the conductive region, wherein the conductive column comprises a lead-free, conductive columnar body and a coating comprising metal on the columnar body, wherein at least a portion of the coating is on a side of the columnar body and
- wherein the coating is an outermost coating of the conductive column.
3 more elements
Dependencies are inferred from the claim text.