H10W 72/01908
Using permanent auxiliary members
Official title: {using permanent auxiliary members, e.g. using alignment marks}
H10W72/01908 (Using permanent auxiliary members) appears on 202 US grants and 274 published applications in this corpus.
Search patents in H10W- Granted patents
- 202
- Published applications
- 274
- Assignees
- 97
- Inventors
- 540
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 4 |
| 2008 | 1 | 0 |
| 2009 | 1 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 3 |
| 2012 | 4 | 4 |
| 2013 | 2 | 4 |
| 2014 | 4 | 10 |
| 2015 | 2 | 7 |
| 2016 | 8 | 9 |
| 2017 | 11 | 14 |
| 2018 | 11 | 16 |
| 2019 | 21 | 27 |
| 2020 | 23 | 19 |
| 2021 | 15 | 21 |
| 2022 | 15 | 33 |
| 2023 | 20 | 37 |
| 2024 | 26 | 23 |
| 2025 | 23 | 28 |
| 2026 | 11 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Molded thin semiconductor die packages and related methods22 Sep 2026US 12,745,662 B2Semiconductor Components Industries, LLC
- Pad metallization with oxide layer to reduce deformation of conductive films18 Aug 2026US 12,713,960 B2Renesas Electronics Corporation
- Cap layer for pad oxidation prevention30 Jun 2026US 12,672,578 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with air gap2 Jun 2026US 12,648,474 B2Nanya Technology Corporation
- Supporting sealant layer structure for stacked die application12 May 2026US 12,628,652 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method of semiconductor device24 Sep 2026US 2026/0293762 A1Kioxia Corporation
- Semiconductor device and formation method thereof20 Aug 2026US 2026/0248018 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Supporting sealant layer structure for stacked die application23 Jul 2026US 2026/0215281 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Seamless bonding layers in semiconductor packages and methods of forming the same11 Jun 2026US 2026/0165203 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Fabricating the Same4 Jun 2026US 2026/0157166 A1United Microelectronics Corp.
Most cited
By later US patents
- Bond pad structure for low temperature flip chip bonding237US 9,536,848 B2Globalfoundries Inc. · 2017
- Method for reducing bonding pad loss using a capping layer when etching bonding pad passivation openings47US 5,985,765 ATaiwan Semiconductor Manufacturing Company.Ltd · 1999
- Electronic component, semiconductor device employing same, and method for manufacturing electronic component28US 7,728,431 B2Sony Corporation · 2010
- Method of forming a bump on a copper pad16US 6,583,039 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2003
- Stacked semiconductor structure and method15US 9,257,414 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016