H10W 72/01951
Changing the shapes of bond pads
Official title: {Changing the shapes of bond pads}
H10W72/01951 (Changing the shapes of bond pads) appears on 2,542 US grants and 3,112 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,542
- Published applications
- 3,112
- Assignees
- 490
- Inventors
- 4,194
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 5 |
| 2002 | 8 | 15 |
| 2003 | 12 | 21 |
| 2004 | 15 | 22 |
| 2005 | 16 | 23 |
| 2006 | 13 | 27 |
| 2007 | 11 | 18 |
| 2008 | 14 | 39 |
| 2009 | 21 | 38 |
| 2010 | 27 | 42 |
| 2011 | 31 | 70 |
| 2012 | 53 | 129 |
| 2013 | 90 | 132 |
| 2014 | 115 | 161 |
| 2015 | 158 | 231 |
| 2016 | 191 | 198 |
| 2017 | 207 | 201 |
| 2018 | 187 | 182 |
| 2019 | 167 | 189 |
| 2020 | 175 | 239 |
| 2021 | 197 | 264 |
| 2022 | 206 | 230 |
| 2023 | 186 | 188 |
| 2024 | 169 | 170 |
| 2025 | 134 | 171 |
| 2026 | 82 | 107 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,790 B2Samsung Electronics Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Direct hybrid bond pad having tapered sidewall29 Sep 2026US 12,751,328 B2Adeia Semiconductor Bonding Technologies Inc.
- Substrate and method of manufacturing the same22 Sep 2026US 12,745,665 B2Samsung Electro-Mechanics Co., Ltd.
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit package and method8 Oct 2026US 2026/0314489 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Semiconductor die package and methods of manufacturing8 Oct 2026US 2026/0314505 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing mosfet device and mosfet device thereof1 Oct 2026US 2026/0304824 A1Chongqing Simic Semiconductor Limited
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014