H10W 72/01953
By etching
Official title: {by etching}
H10W72/01953 (By etching) appears on 1,433 US grants and 1,744 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,433
- Published applications
- 1,744
- Assignees
- 315
- Inventors
- 2,468
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 6 |
| 2003 | 4 | 10 |
| 2004 | 5 | 12 |
| 2005 | 9 | 11 |
| 2006 | 7 | 17 |
| 2007 | 7 | 8 |
| 2008 | 11 | 23 |
| 2009 | 11 | 21 |
| 2010 | 16 | 24 |
| 2011 | 12 | 41 |
| 2012 | 33 | 73 |
| 2013 | 41 | 67 |
| 2014 | 72 | 81 |
| 2015 | 80 | 139 |
| 2016 | 108 | 101 |
| 2017 | 119 | 104 |
| 2018 | 97 | 95 |
| 2019 | 87 | 101 |
| 2020 | 96 | 147 |
| 2021 | 119 | 161 |
| 2022 | 128 | 144 |
| 2023 | 111 | 113 |
| 2024 | 103 | 93 |
| 2025 | 82 | 88 |
| 2026 | 44 | 63 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit package and method8 Oct 2026US 2026/0314489 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Method for manufacturing mosfet device and mosfet device thereof1 Oct 2026US 2026/0304824 A1Chongqing Simic Semiconductor Limited
- Method for forming bumps on substrate10 Sep 2026US 2026/0271762 A1Skytech
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014