H10W 72/01955
By using masks
Official title: {by using masks}
H10W72/01955 (By using masks) appears on 807 US grants and 939 published applications in this corpus.
Search patents in H10W- Granted patents
- 807
- Published applications
- 939
- Assignees
- 245
- Inventors
- 1,503
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 2 |
| 2002 | 5 | 3 |
| 2003 | 6 | 7 |
| 2004 | 5 | 7 |
| 2005 | 4 | 10 |
| 2006 | 5 | 12 |
| 2007 | 4 | 11 |
| 2008 | 5 | 12 |
| 2009 | 7 | 14 |
| 2010 | 10 | 15 |
| 2011 | 13 | 23 |
| 2012 | 18 | 41 |
| 2013 | 26 | 50 |
| 2014 | 40 | 60 |
| 2015 | 53 | 75 |
| 2016 | 62 | 59 |
| 2017 | 77 | 67 |
| 2018 | 64 | 62 |
| 2019 | 54 | 54 |
| 2020 | 56 | 75 |
| 2021 | 64 | 85 |
| 2022 | 61 | 71 |
| 2023 | 48 | 38 |
| 2024 | 49 | 37 |
| 2025 | 35 | 34 |
| 2026 | 14 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Multi-metal contact structure in microelectronic assembly1 Sep 2026US 12,727,514 B2Adeia Semiconductor Bonding Technologies Inc.
- Pad metallization with oxide layer to reduce deformation of conductive films18 Aug 2026US 12,713,960 B2Renesas Electronics Corporation
- Semiconductor package having first pad and second pad11 Aug 2026US 12,708,010 B2Samsung Electronics Co., Ltd.
- Semiconductor device, equipment, and manufacturing method of semiconductor device19 May 2026US 12,635,269 B2Canon Kabushiki Kaisha
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- Method for manufacturing component, component, and hybrid bonding equipment30 Jul 2026US 2026/0223730 A1Panasonic Intellectual Property Management Co., Ltd.
- Advanced processes for cu/polymer hybrid bonding for fine-pitch interconnection at panel level23 Jul 2026US 2026/0215322 A1Georgia Tech Research Corporation
- Under-bump metallization structure and methods of forming the same18 Jun 2026US 2026/0173940 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method for wafer-wafer bonding238US 9,941,241 B2International Business Machines Corporation · 2018
- Multi-metal contact structure in microelectronic component173US 11,088,099 B2Invensas Bonding Technologies, Inc. · 2021
- Systems and methods for releveled bump planes for chiplets162US 11,348,898 B2Xcelsis Corporation · 2022
- Flat metal features for microelectronics applications161US 10,840,135 B2Invensas Corporation · 2020