Semiconductor package having first pad and second pad

A semiconductor package comprising:

• a first semiconductor chip stacked on a second semiconductor chip;
• the first semiconductor chip including a first substrate, a first wiring structure under the first substrate, a first pad connected to the first wiring structure, and a first insulating layer surrounding the first pad,
• wherein the first semiconductor chip further includes a connection pad surrounded by the first insulating layer, spaced apart from the first pad, having an inclined side surface, and having a width that increases toward the first substrate;
• and
• the second semiconductor chip including a second substrate, a second wiring structure on the second substrate, a second pad connected to the second wiring structure and contacting the first pad, and a second insulating layer surrounding the second pad and contacting the first insulating layer,
• wherein an angle formed between a side surface of the first pad and a lower surface of the first pad is in a range from about 90° to about 110°, and
• an angle between a side surface of the second pad and an upper surface of the second pad is in a range from about 90° to about 110°.

A semiconductor package comprising:

• a first semiconductor chip stacked on a second semiconductor chip;
• the first semiconductor chip including a first substrate, a first pad under the first substrate, and a first insulating layer surrounding the first pad;
• and
• the second semiconductor chip including a second substrate, a second pad on the second substrate, and a second insulating layer surrounding the second pad and contacting the first insulating layer,
• wherein the first pad includes a lower surface and an opposing upper surface,
• the second pad includes an upper surface contacting the lower surface of the first pad and an opposing lower surface,
• a width of the upper surface of the first pad is greater than a width of the lower surface of the first pad,
• a width of the lower surface of the second pad is greater than a width of the upper surface of the second pad, and
• the width of the lower surface of the first pad is different from the width of the upper surface of the second pad.