Advanced processes for cu/polymer hybrid bonding for fine-pitch interconnection at panel level

Abstract

An exemplary device and method that provides sub-10-um fine pitch interconnection between (i) a protruding pillar structure with Cu (e.g., nano-twinned Cu) on one surface having a B-stageable/Photo imageable polymer and (ii) a corresponding concave landing pad with Cu (e.g., nano-twinned Cu) on the other surface also having a same B-stageable/Photo imageable polymer, to provide for insertions for Cu-Cu bonding and B-stageable/Photo imageable polymers bonding. The Cu-Cu bonding and polymer bonding can facilitate a seamless bond interface at a low bonding temperature of 150° C. or even at room temperature (RT) with cleaned and improved surfaces.

Dependencies are inferred from the claim text.