H10W 90/00
Package configurations
H10W90/00 (Package configurations) appears on 99,954 US grants and 119,744 published applications in this corpus.
Search patents in H10W- Granted patents
- 99,954
- Published applications
- 119,744
- Assignees
- 8,333
- Inventors
- 97,146
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 61 | 0 |
| 1977 | 63 | 0 |
| 1978 | 61 | 0 |
| 1979 | 47 | 0 |
| 1980 | 54 | 0 |
| 1981 | 63 | 0 |
| 1982 | 63 | 0 |
| 1983 | 66 | 0 |
| 1984 | 74 | 0 |
| 1985 | 125 | 0 |
| 1986 | 128 | 0 |
| 1987 | 164 | 0 |
| 1988 | 161 | 0 |
| 1989 | 240 | 0 |
| 1990 | 271 | 0 |
| 1991 | 389 | 0 |
| 1992 | 384 | 0 |
| 1993 | 393 | 0 |
| 1994 | 528 | 0 |
| 1995 | 561 | 0 |
| 1996 | 638 | 0 |
| 1997 | 685 | 0 |
| 1998 | 1007 | 0 |
| 1999 | 1083 | 0 |
| 2000 | 1191 | 0 |
| 2001 | 1529 | 753 |
| 2002 | 1728 | 2238 |
| 2003 | 1918 | 2282 |
| 2004 | 2003 | 2697 |
| 2005 | 1858 | 3126 |
| 2006 | 2044 | 3198 |
| 2007 | 2042 | 3467 |
| 2008 | 1846 | 3729 |
| 2009 | 2061 | 3785 |
| 2010 | 2981 | 3747 |
| 2011 | 3179 | 3915 |
| 2012 | 3283 | 4281 |
| 2013 | 3692 | 4335 |
| 2014 | 4097 | 4734 |
| 2015 | 4389 | 5037 |
| 2016 | 4578 | 4666 |
| 2017 | 4696 | 4785 |
| 2018 | 4354 | 4827 |
| 2019 | 4873 | 5524 |
| 2020 | 4935 | 6397 |
| 2021 | 4755 | 6618 |
| 2022 | 4981 | 7164 |
| 2023 | 5044 | 7336 |
| 2024 | 5168 | 8235 |
| 2025 | 5410 | 7753 |
| 2026 | 4010 | 5115 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 90/701Package configurations: characterised by the relative positions of pads or connectors relative79,091
- H10W 90/20Configurations of stacked chips17,695
- H10W 90/401Package configurations: characterised by multiple insulating or insulated package substrates, interposers or6,319
- H10W 90/811Multiple chips on leadframes4,214
- H10W 90/10Configurations of laterally-adjacent chips1,900
Recent patents
- Integrated circuit package and method of manufacturing the same6 Oct 2026US 12,754,862 B2SK hynix Inc.
- Display apparatuses, display panels, and methods of driving display panels6 Oct 2026US 12,755,672 B2BOE MLED Technology Co., Ltd.
- Display device6 Oct 2026US 12,755,680 B2Innolux Corporation
- Semiconductor device6 Oct 2026US 12,756,183 B2Socionext Inc.
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- Semiconductor devices configured for repairing defective bumps8 Oct 2026US 2026/0309777 A1SK hynix Inc.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Optical multi-chip interconnect bridge architecture and fabrication processes8 Oct 2026US 2026/0309917 A1Sicily Merger Sub II, Inc.
Most cited
By later US patents
- Large scale photolithographic solid phase synthesis of polypeptides and receptor binding screening thereof1,998US 5,143,854 AAffymax Technologies N.V. · 1992
- Transparent contacts for organic devices1,986US 5,703,436 AThe Trustees of Princeton University · 1997
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016