Semiconductor device
AssigneeSocionext Inc.
InventorIsaya Sobue
Life of this patent
Estimating the term…
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AssigneeSocionext Inc.
InventorIsaya Sobue
Estimating the term…
A semiconductor device includes: a substrate; first, second, and third substrate power-supply interconnects in the substrate; first and second substrate clamp circuits in the substrate, between the first and second substrate power-supply interconnects, and between the first and third substrate power-supply interconnects, respectively; first and second semiconductor chips on the substrate; first and second chip power-supply interconnects in the first semiconductor chip, electrically-connected to the first substrate power-supply interconnect and to the second substrate power-supply interconnect, respectively; a first circuit in the first semiconductor chip, between the first and second chip power-supply interconnects; third and fourth chip power-supply interconnects in the second semiconductor chip, electrically-connected to the first substrate power-supply interconnect and to the third substrate power-supply interconnect, respectively; and a second circuit in the second semiconductor chip, between the third and fourth chip power-supply interconnects, and a signal from the first circuit is input to the second circuit.
A semiconductor device comprising:
Dependencies are inferred from the claim text.