H10W 90/811
Multiple chips on leadframes
Official title: {Multiple chips on leadframes}
H10W90/811 (Multiple chips on leadframes) appears on 4,214 US grants and 5,037 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,214
- Published applications
- 5,037
- Assignees
- 673
- Inventors
- 5,886
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 6 | 0 |
| 1990 | 8 | 0 |
| 1991 | 13 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 17 | 0 |
| 1995 | 21 | 0 |
| 1996 | 29 | 0 |
| 1997 | 24 | 0 |
| 1998 | 29 | 0 |
| 1999 | 16 | 0 |
| 2000 | 24 | 0 |
| 2001 | 45 | 34 |
| 2002 | 62 | 84 |
| 2003 | 57 | 80 |
| 2004 | 69 | 91 |
| 2005 | 64 | 117 |
| 2006 | 83 | 96 |
| 2007 | 80 | 150 |
| 2008 | 83 | 191 |
| 2009 | 91 | 170 |
| 2010 | 141 | 145 |
| 2011 | 156 | 157 |
| 2012 | 148 | 175 |
| 2013 | 169 | 211 |
| 2014 | 212 | 250 |
| 2015 | 259 | 275 |
| 2016 | 245 | 251 |
| 2017 | 239 | 230 |
| 2018 | 198 | 221 |
| 2019 | 237 | 254 |
| 2020 | 211 | 260 |
| 2021 | 199 | 244 |
| 2022 | 206 | 270 |
| 2023 | 182 | 310 |
| 2024 | 205 | 336 |
| 2025 | 201 | 256 |
| 2026 | 157 | 179 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Semiconductor module6 Oct 2026US 12,757,769 B2Shindengen Electric Manufacturing Co., Ltd.
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314432 A1Renesas Electronics Corporation
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Apparatus including an isolation assembly1 Oct 2026US 2026/0305369 A1
- Semiconductor device and method of manufacturing semiconductor device1 Oct 2026US 2026/0305383 A1Mitsubishi Electric Corporation
- Dual die device with conductive plate substrate connection1 Oct 2026US 2026/0305384 A1
Most cited
By later US patents
- Stacked multi-chip modules and method of manufacturing346US 5,422,435 ANational Semiconductor Corporation · 1995
- Semiconductor package having stacked dice and leadframes and method of fabrication303US 6,303,981 B1Micron Technology, Inc. · 2001
- Integrated circuit package having a face-to-face IC chip arrangement292US 5,438,224 AMotorola, Inc. · 1995
- Miniature 3D multi-chip module289US 6,426,559 B1National Semiconductor Corporation · 2002
- Method of forming a semiconductor package and structure thereof283US 7,030,469 B2Freescale Semiconductor, Inc. · 2006