Miniature 3D multi-chip module

A multi-chip module, comprising:

• a plurality of leads with a first side and a second side;
• a first semiconductor device with a first side and a second side, wherein the first side of the first semiconductor device is connected to the first side of the plurality of leads;
• a second semiconductor device with a first side and a second side stacked on the first side of the first semiconductor device, wherein the first side of the second semiconductor device is connected to the first side of the first semiconductor device;
• and
• a first plurality of conductive elements providing electrical and physical connections between the first side of the leads and the first side of the first semiconductor device.

A multi-chip module, comprising:

• a lead frame having a plurality of leads;
• a first semiconductor device including a first side having a multiplicity of first contacts thereon and a second side, wherein a first set of the first contacts are electrically coupled to associated leads by a first set of conductive elements;
• a second semiconductor device having a multiplicity of second contacts thereon, wherein at least some of the second contacts are electrically coupled to associated ones of a second set of the first contacts by a second set of conductive elements;
• and
• a third semiconductor device stacked on the second semiconductor device, the third semiconductor device including a plurality of third contacts wherein at least some of the third contacts are electrically connected to associated leads on the lead frame by bonding wires.

A multi-chip module, comprising:

• a lead frame having a plurality of leads having first and second surfaces;
• a first semiconductor device including a first side having a multiplicity of first contacts thereon and a second side, wherein a first set of the first contacts are electrically coupled to the first surfaces of associated leads by a first set of contact bumps;
• a second semiconductor device having a multiplicity of second contacts thereon, wherein at least some of the second contacts are electrically coupled to the second surfaces of associated ones of the leads by bonding wires;
• and
• a third semiconductor device interposed between the first and second semiconductor devices, the third semiconductor device including a plurality of third contacts wherein at least some of the third contacts are electrically coupled to associated ones of the first or second contacts by a second set of contact bumps.

A multi-chip module, comprising:

• a lead frame having a plurality of leads having first and second surfaces;
• a first semiconductor device including a first side having a multiplicity of first contacts thereon and a second side, wherein a first set of the first contacts are electrically coupled to the first surfaces of associated leads by a first set of contact bumps;
• a second semiconductor device having a multiplicity of second contacts thereon, wherein at least some of the second contacts are electrically coupled to the second surfaces of associated ones of the leads by bonding wires;
• and
• a third semiconductor device stacked on top of the second semiconductor device, the third semiconductor device including a plurality of third contacts wherein at least some of the third contacts are electrically coupled to associated ones of the second contacts by a second set of contact bumps.

A multi-chip module, comprising:

• a lead frame having a plurality of leads having first and second surfaces;
• a stack of at least three semiconductor devices stacked upon one another, each semiconductor device having a plurality of contacts formed thereon, wherein,
• at least a first one of the semiconductor devices has a set of contacts that are coupled to the first surface of the plurality of leads,
• at least a second one of the semiconductor devices has a set of contacts that are coupled the second surface of the leads, and
• at least two of the semiconductor devices each having a set of contacts that are electrically coupled to one another by a first set of contact bumps.