H10W 90/401
Package configurations: characterised by multiple insulating or insulated package substrates, interposers or
Official title: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
H10W90/401 (Package configurations: characterised by multiple insulating or insulated package substrates, interposers or) appears on 6,319 US grants and 9,206 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,319
- Published applications
- 9,206
- Assignees
- 952
- Inventors
- 10,089
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 10 | 0 |
| 1989 | 17 | 0 |
| 1990 | 21 | 0 |
| 1991 | 31 | 0 |
| 1992 | 22 | 0 |
| 1993 | 25 | 0 |
| 1994 | 25 | 0 |
| 1995 | 25 | 0 |
| 1996 | 27 | 0 |
| 1997 | 26 | 0 |
| 1998 | 43 | 0 |
| 1999 | 36 | 0 |
| 2000 | 45 | 0 |
| 2001 | 58 | 22 |
| 2002 | 49 | 60 |
| 2003 | 64 | 66 |
| 2004 | 63 | 108 |
| 2005 | 61 | 117 |
| 2006 | 86 | 106 |
| 2007 | 72 | 107 |
| 2008 | 63 | 121 |
| 2009 | 65 | 128 |
| 2010 | 111 | 124 |
| 2011 | 108 | 104 |
| 2012 | 96 | 107 |
| 2013 | 96 | 111 |
| 2014 | 114 | 172 |
| 2015 | 140 | 203 |
| 2016 | 198 | 250 |
| 2017 | 232 | 246 |
| 2018 | 234 | 289 |
| 2019 | 289 | 363 |
| 2020 | 328 | 579 |
| 2021 | 434 | 794 |
| 2022 | 540 | 824 |
| 2023 | 607 | 1041 |
| 2024 | 647 | 1051 |
| 2025 | 730 | 1186 |
| 2026 | 443 | 927 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package6 Oct 2026US 12,757,745 B2Samsung Electronics Co., Ltd.
- Power semiconductor package6 Oct 2026US 12,757,757 B2Pierburg GmbH
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Copper rings for BGA count reduction in small form factor packages6 Oct 2026US 12,757,801 B2Intel Corporation
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit stack8 Oct 2026US 2026/0314412 A1Etron Technology, Inc.
- Semiconductor package and cooling system thereof8 Oct 2026US 2026/0314414 A1Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314441 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Multichip integrated circuit packaging configuration and method379US 4,783,695 AGeneral Electric Company · 1988
- Compact high density interconnect structure379US 5,241,456 AGeneral Electric Company · 1993
- Three dimensional integrated circuit package361US 5,016,138 A1991
- Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities352US 7,049,170 B2Tru-Si Technologies, Inc. · 2006