Semiconductor package

A semiconductor package comprising:

• a first redistribution substrate comprising a first redistribution insulating layer and a first redistribution via;
• a first insulating layer on the first redistribution substrate;
• a solder pad on the first insulating layer;
• a first alignment key penetrating the first insulating layer and extending to an inside of the first redistribution insulating layer;
• and
• a solder via spaced apart from the first alignment key and electrically connected to the solder pad,
• wherein the first alignment key comprises:
• a first key body extending from a first surface of the first insulating layer into the inside of the first redistribution substrate;
• and
• a first key protrusion protruding from a side surface of the first key body toward the first insulating layer, and
• wherein the first insulating layer comprises filler grains.

A semiconductor package comprising:

• an intervening redistribution substrate comprising an intervening redistribution insulating layer and an intervening redistribution via;
• a first insulating layer on the intervening redistribution substrate;
• a solder pad on the first insulating layer;
• a solder via on the solder pad electrically connected to the solder pad;
• and
• a first alignment key spaced apart from the solder via and penetrating the first insulating layer,
• wherein the first alignment key comprises a first key body extending from a first surface of the first insulating layer into an inside of the intervening redistribution substrate, and a first key protrusion protruding from a side surface of the first key body toward the first insulating layer, and
• wherein the first insulating layer comprises a non-photosensitive material.