H10W 90/20
Configurations of stacked chips
H10W90/20 (Configurations of stacked chips) appears on 17,695 US grants and 23,208 published applications in this corpus.
Search patents in H10W- Granted patents
- 17,695
- Published applications
- 23,208
- Assignees
- 1,628
- Inventors
- 19,511
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 11 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 14 | 0 |
| 1991 | 28 | 0 |
| 1992 | 19 | 0 |
| 1993 | 23 | 0 |
| 1994 | 39 | 0 |
| 1995 | 52 | 0 |
| 1996 | 65 | 0 |
| 1997 | 89 | 0 |
| 1998 | 102 | 0 |
| 1999 | 98 | 0 |
| 2000 | 109 | 0 |
| 2001 | 132 | 85 |
| 2002 | 207 | 282 |
| 2003 | 213 | 314 |
| 2004 | 257 | 407 |
| 2005 | 234 | 440 |
| 2006 | 302 | 538 |
| 2007 | 321 | 573 |
| 2008 | 289 | 619 |
| 2009 | 349 | 677 |
| 2010 | 554 | 737 |
| 2011 | 666 | 742 |
| 2012 | 659 | 875 |
| 2013 | 733 | 819 |
| 2014 | 832 | 840 |
| 2015 | 857 | 995 |
| 2016 | 966 | 859 |
| 2017 | 872 | 847 |
| 2018 | 827 | 843 |
| 2019 | 828 | 937 |
| 2020 | 853 | 1159 |
| 2021 | 896 | 1347 |
| 2022 | 1010 | 1468 |
| 2023 | 1133 | 1639 |
| 2024 | 1098 | 1738 |
| 2025 | 1147 | 1856 |
| 2026 | 774 | 1572 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 90/297Characterised by the through-semiconductor vias [tsvs] in the stacked chips7,846
- H10W 90/291Characterised by containers, encapsulations, or other housings for the stacked chips3,604
- H10W 90/288Characterised by arrangements for thermal management of the stacked chips3,265
- H10W 90/22The stacked chips being on both top and bottom sides of a3,022
- H10W 90/24At least one of the stacked chips being laterally offset from a2,750
- H10W 90/28The stacked chips having different sizes2,336
- H10W 90/26The stacked chips being of the same size without any chips being1,946
- H10W 90/293Characterised by non-galvanic coupling between the chips1,082
All 12 subgroupsShow fewer
Recent patents
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Most cited
By later US patents
- Transparent contacts for organic devices1,986US 5,703,436 AThe Trustees of Princeton University · 1997
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015