H10W 90/231
The stacked chips being on both top and bottom sides of an
Official title: {the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure}
H10W90/231 (The stacked chips being on both top and bottom sides of an) appears on 830 US grants and 994 published applications in this corpus.
Search patents in H10W- Granted patents
- 830
- Published applications
- 994
- Assignees
- 241
- Inventors
- 1,590
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 5 |
| 2002 | 32 | 44 |
| 2003 | 32 | 49 |
| 2004 | 23 | 44 |
| 2005 | 30 | 52 |
| 2006 | 44 | 72 |
| 2007 | 37 | 90 |
| 2008 | 38 | 86 |
| 2009 | 39 | 67 |
| 2010 | 59 | 46 |
| 2011 | 56 | 39 |
| 2012 | 45 | 38 |
| 2013 | 44 | 31 |
| 2014 | 35 | 24 |
| 2015 | 26 | 25 |
| 2016 | 32 | 21 |
| 2017 | 14 | 25 |
| 2018 | 18 | 20 |
| 2019 | 29 | 38 |
| 2020 | 24 | 30 |
| 2021 | 30 | 40 |
| 2022 | 26 | 29 |
| 2023 | 27 | 31 |
| 2024 | 26 | 23 |
| 2025 | 17 | 13 |
| 2026 | 6 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package11 Aug 2026US 12,708,051 B2Samsung Electronics Co., Ltd.
- Tablet ultrasound system26 May 2026US 12,635,979 B2TeraTech Corporation
- Semiconductor package and method of manufacturing the semiconductor package5 May 2026US 12,622,000 B2Samsung Electronics Co., Ltd.
- Tablet ultrasound system31 Mar 2026US 12,588,893 B2TeraTech Corporation
- Semiconductor device and semiconductor device manufacturing method3 Feb 2026US 12,543,591 B2Kioxia Corporation
- Backside power delivery20 Aug 2026US 2026/0247966 A1
- Backside power delivery20 Aug 2026US 2026/0247967 A1
- Semiconductor package and method of manufacturing the semiconductor package13 Aug 2026US 2026/0239631 A1Samsung Electronics Co., Ltd.
- Tablet ultrasound system30 Jul 2026US 2026/0215758 A1TeraTech Corporation
- Semiconductor package and method of manufacturing the same23 Jul 2026US 2026/0215325 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Packaged microelectronic die assemblies and methods of manufacture337US 6,560,117 B2Micron Technology, Inc. · 2003
- High bandwidth cache-to-processing unit communication in a multiple processor/cache system268US 7,777,330 B2Freescale Semiconductor, Inc. · 2010
- Chips arranged in plurality of planes and electrically connected to one another242US 6,281,577 B1Pac Tech—Packaging Technologies GmbH · 2001
- High density semiconductor package223US 5,990,566 AMicron Technology, Inc. · 1999
- Method for packaging semiconductor dice219US 5,593,927 AMicron Technology, Inc. · 1997